Products

Flexible Device Process

Film Lamination Equipment (Roller lamination)

FR Series using OCA
With our process, a flexible material sheet held by air suction on the stage plate is tilted against the surface of the hard target object, and securely bonds to the target by the roller pressure applied from an edge where the tilted sheet first touches the target object. This lamination process squeezes out air bubbles, which dramatically contributes in achieving high yield. This is suitable for flexible materials such as films.

Applicable material sizes:

1 to 10 inch 4 to 15.6 inch 5 to 10 inch 7 to 27 inch
10 to 32 inch 60 to 90 inch    

RS Series using OCA
This is an inline device which handles rolled material; to a roll of sensor film lamination of sheeted OCA is performed from both sides with high degree of accuracy, and fully cut to required product size.
As it carries out roll transfer, separator peeling, laminating and punching, all in automatic, it saves cost and labor when compared to manufacturing with semi-automatic equipment for each processes.

Applicable material size:

500mm width

Film Lamination Equipment (Roller lamination)

Film Lamination and Removal Equipment (change laminated films)

FT Series
It removes device on film from the film and apply new film to the device.  This process is used for hard-to-handle-by-itself thin materials.

Applicable material size:

50x50mm to 300x220mm

Film Lamination and Removal Equipment (change laminated films)

Carrier Glass Delamination Equipment (Mechanical peeling)

GD Series
This is to delaminate (mechanical peeling) carrier glass from plastic substrate, from carrier glass side, after a film device layer is processed on the plastic substrate.  Because the plastic substrate is  kept basically untouched while carrier glass is being peeled, stress applied to the  film substrate (on which film device layer is processed) is minimized.

Applicable material size:

G6 half

Carrier Glass Delamination Equipment (Mechanical peeling)

Film Punching Equipment (Blade punching)

FP Series
This handles film substrates both in roll and those come in sheet, full-cuts or half-cuts, and process holes.

It is possible to combine punching and lamination processes.  This is to be able to match with variety of market request where it ranges from handling of one layer film to multiple layer film, and asking to attach a punching process to a lamination machine.

Applicable material size:

500mm width

Film Punching Equipment (Blade punching)

Glass Device Process Equipment (Rigid)

Glass Attachment Equipment  (Roller Lamination)

GO Series (OCA)
With our Glass Bend Lamination System, materials such as LCD and OLED held by air suction on the stage is tilted against the surface of the hard target object, such as CG, and securely bonds to the target by the roller pressure applied from a side where the tilted sheet first touches the target object. This lamination process squeezes out air bubbles which dramatically contributes to increasing yield rate. This is suitable for lamination of rigid materials, and uses OCA.

Applicable material size:

4 to 15.6 inch 7 to 27 inch 10 to 32 inch 60 to 90 inch

GU Series (OCR)
This slit coats OCR in high accuracy, pre-cure it with UV irradiation, and laminates with roller by slightly bending a CG; all in one device.  Suitable for processes that require highly precision OCR coating where excesses at edges need to be minimized.  This is suitable for lamination of rigid materials.

Applicable material size:

4 to 15 inch

Glass Attachment Equipment  (Roller Lamination)

Curved Glass Lamination Equipment (Transfer Lamination)

GF Series
The process first transfers a material to a carrier tape; this is to hold materials and adjust the angle against a target object while being laminated by roller.  This system controls the angle of materials transferred on the carrier tape to secure the optimum lamination conditions: minimize air bubbles, and be able to cope with various materials shapes and curvatures.

Applicable material size:

7 to 17 inch

Curved Glass Lamination Equipment (Transfer Lamination)
Glass Substrate Polishing and Cleaning Equipment

Glass Substrate Polishing and Cleaning Equipment

PP Series
A fully automatic device that removes foreign matters without damaging a sensor membrane of display surface by rotation of the dedicated polishing pad, pure water washing and air knife drying. It is suitable for the cleaning of glass substrates, such as LCDs or OLEDs.

Applicable material size:

3 to 8 inch 7 to 15.6 inch    
  Glass Substrate Polishing and Cleaning Equipment