Products
Flexible Device Process
FR Series using OCA
With our process, a flexible material sheet held by air suction on the stage plate is tilted against the surface of the hard target object, and securely bonds to the target by the roller pressure applied from an edge where the tilted sheet first touches the target object. This lamination process squeezes out air bubbles, which dramatically contributes in achieving high yield. This is suitable for flexible materials such as films.
Applicable material sizes:
1 to 10 inch | 4 to 15.6 inch | 5 to 10 inch | 7 to 27 inch |
10 to 32 inch | 60 to 90 inch |
RS Series using OCA
This is an inline device which handles rolled material; to a roll of sensor film lamination of sheeted OCA is performed from both sides with high degree of accuracy, and fully cut to required product size.
As it carries out roll transfer, separator peeling, laminating and punching, all in automatic, it saves cost and labor when compared to manufacturing with semi-automatic equipment for each processes.
Applicable material size:
500mm width

FT Series
It removes device on film from the film and apply new film to the device. This process is used for hard-to-handle-by-itself thin materials.
Applicable material size:
50x50mm to 300x220mm

GD Series
This is to delaminate (mechanical peeling) carrier glass from plastic substrate, from carrier glass side, after a film device layer is processed on the plastic substrate. Because the plastic substrate is kept basically untouched while carrier glass is being peeled, stress applied to the film substrate (on which film device layer is processed) is minimized.
Applicable material size:
G6 half

FP Series
This handles film substrates both in roll and those come in sheet, full-cuts or half-cuts, and process holes.
It is possible to combine punching and lamination processes. This is to be able to match with variety of market request where it ranges from handling of one layer film to multiple layer film, and asking to attach a punching process to a lamination machine.
Applicable material size:
500mm width

Glass Device Process Equipment (Rigid)
GO Series (OCA)
With our Glass Bend Lamination System, materials such as LCD and OLED held by air suction on the stage is tilted against the surface of the hard target object, such as CG, and securely bonds to the target by the roller pressure applied from a side where the tilted sheet first touches the target object. This lamination process squeezes out air bubbles which dramatically contributes to increasing yield rate. This is suitable for lamination of rigid materials, and uses OCA.
Applicable material size:
4 to 15.6 inch | 7 to 27 inch | 10 to 32 inch | 60 to 90 inch |
GU Series (OCR)
This slit coats OCR in high accuracy, pre-cure it with UV irradiation, and laminates with roller by slightly bending a CG; all in one device. Suitable for processes that require highly precision OCR coating where excesses at edges need to be minimized. This is suitable for lamination of rigid materials.
Applicable material size:
4 to 15 inch

GF Series
The process first transfers a material to a carrier tape; this is to hold materials and adjust the angle against a target object while being laminated by roller. This system controls the angle of materials transferred on the carrier tape to secure the optimum lamination conditions: minimize air bubbles, and be able to cope with various materials shapes and curvatures.
Applicable material size:
7 to 17 inch

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PP Series Applicable material size:
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